QIMONDA AG
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 6-K
Report of Foreign Private Issuer
Pursuant to Rule 13a-16 or 15d-16 of
the Securities Exchange Act of 1934
February 12, 2009
QIMONDA AG
Gustav-Heinemann-Ring 212
D-81739 Munich
Federal Republic of Germany
Tel: +49-89-60088-0
(Address of principal executive offices)
Indicate by check mark whether the registrant files or will file annual reports under cover of Form
20-F or Form 40-F.
Form 20-F þ Form 40-F o
Indicate by check mark whether the registrant by furnishing the information contained in this Form
is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the
Securities Exchange Act of 1934.
Yes o No þ
If Yes is marked, indicate below the file number assigned to the registrant in connection with
Rule 12g3-2(b): 82- .
This Report on Form 6-K is incorporated by reference into the registration statement on Form F-3,
File No. 333-145983.
This Report on Form 6-K contains the following press releases of Qimonda AG, which are hereby
incorporated by reference into the Registration Statement on Form F-3, Registration No. 333-145983:
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February 3, 2009 Continuing development of Buried Wordline Technology and streamlining
production capacities, including ramp down of the Richmond 300mm facility. |
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February 3, 2009 Presenting the worlds smallest DRAM chip based on its advanced
Buried Wordline Technology, awarded as DDR3 market leader by Intel. |
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February 10, 2009 Cutting costs by reduction wafer starts at Dresden facility and
improving productivity due to progress in development of 46nm Buried Wordline Technology. |
News
Release § Presseinformation
Qimonda pushes ahead with the development of its innovative Buried Wordline Technology and
streamlines production capacities.
Munich February 3, 2009 Qimonda AG (OTC: QMNDQ.PK) is making consistent advances in its
orientation towards its Buried Wordline technology. After seeing the first generation with a size
of 65nm achieve good results in mass production in Dresden, the developers have now created the
first operational DDR3 memory modules based on the latest 46nm technology.
The new 46nm technology will triple the number of chips per wafer compared with the current 75nm
technology, and thus is expected to increase production efficiency by 200 percent. Furthermore,
preliminary results show that power consumption will be reduced by up to 75 percent. We are
confident that our new technology is the key innovation for us to move onwards into a lucrative
future, says Thomas Seifert, CFO and COO of Qimonda AG. The first successful test runs with the
new 46nm module generation and the customer feedback up to now have been very encouraging.
Industry experts believe that this new generation of chip represents a clear advantage for Qimonda
over the competition. The global market leader Intel Corporation also recently confirmed Qimondas
leading position in DDR3 technology.
The focus on Buried Wordline technology is therefore a key element of Qimondas global
restructuring and cost-reduction programme. At the same time, in order to stabilise its ongoing
operations even further, loss-making products and contracts are
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Page 2
of 3 February 3, 2009
being discontinued and core production activities are being intensified. This is the reason that
production will now be ramped down at the Richmond 300mm manufacturing facility, Virginia (USA).
Given the current macroeconomic climate, it is not possible to finance a conversion of this
facility for Buried Wordline technology production. In the future, more customers will be supplied
with chips from the plant in Dresden. Approximately 1,500 employees are affected by this
restructuring measure. Production at the other Qimonda AG facilities continues for the time being.
This is an essential step for us in order to improve our production efficiency and thoroughly
orient Qimonda towards the next generation of memory, the innovative Buried Wordline technology,
said Thomas Seifert, member of the management board of Qimonda. In addition, establishing the
viability of the core development and production capabilities of the company is a critical first
step in the search for new investors.
No final decisions have yet been taken concerning the future structure of the company, including
whether those of its businesses that can be continued will be held through Qimonda AG or placed in
a new company owned by new investors. In the latter case,
or if investors cannot be found to finance the continuation of Qimondas businesses, Qimonda AG
would likely be liquidated.
About Qimonda
Qimonda AG (NYSE: QI) is a global memory supplier with a diversified DRAM product portfolio. The
company generated net sales of Euro 1.79 billion in financial year 2008 and had prior to its
announcement of a repositioning of its business approximately 12,200 employees worldwide, of
which 1,400 were in Munich, 3,200 in Dresden and 2,800 in Richmond (Virginia, USA). The company
provides DRAM products with a focus
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Page 3
of 3 February 3, 2009
on infrastructure and graphics applications, using its power
saving technologies and designs. Qimonda is an active innovator and brings high performance, low
power consumption and small chip sizes to the market based on its breakthrough Buried Wordline
technology. Qimonda is currently continuing its operations while in the early stages of insolvency
proceedings under German law. Further information is available at www.qimonda.com.
Disclaimer
This press release contains forward-looking statements based on assumptions and forecasts made by
Qimonda management and third parties. Statements that are not historical facts, including
statements about our beliefs and expectations, are forward-looking statements. These statements are
based on current plans, estimates and projections, and speak only as of the date they are made. We
undertake no obligation to update any of them in light of new information or future events. These
forward-looking statements involve inherent risks and are subject to a number of uncertainties,
including trends in demand and prices for semiconductors generally and for our products in
particular, the success of our development efforts, both alone and with our partners, the success
of our efforts to introduce new production processes at our facilities and the actions of our
competitors, the availability of funds for planned investments and repositioning efforts and the
outcome of antitrust investigations and litigation matters, as well as other factors. We caution
you that these and a number of other known and unknown risks, uncertainties and other factors could
cause actual future results, or outcomes to differ materially from those expressed in any
forward-looking statement. These factors include those identified under the heading Risk Factors
in our most recent Annual Report on Form 20-F which is available without charge on our website and
at www.sec.gov
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New Release § Presseinformation
Qimonda presents worlds smallest DRAM chip based on its advanced Buried Wordline Technology;
Qimonda awarded as DDR3 market leader by Intel
Munich, Germany February 3, 2009 Qimonda AG (OTC: QMNDQ.PK) today announced first functional
modules based on the smallest 2 Gigabit memory chip ever announced in the worldwide DRAM industry.
The new 2 Gigabit DDR3 DRAM is based on Qimondas leading 46nm Buried Wordline technology and has a
die size of less than 55mm2, translating into a significant improvement in productivity compared to
todays technologies. Qimonda originally intended to start commercial production of the new chip by
mid 2009 and is actively seeking financing partners to enable this timeline. Recently, Intel
Corporation recognized Qimondas leading position in DDR3 technology and awarded the company for
its engagement.
Qimondas 46nm technology will triple the number of chips per wafer compared to the current 75nm
technology. At the same time, the chip is expected to significantly reduce power consumption by up
to 75 percent in high-density DDR3 (Double Data Rate) modules. The new technology is the ideal
platform to boost the markets conversion from DDR2 to DDR3 technology predicted for mid-2009.
Qimondas technology roadmap ideally complements this conversion.
With the first functional chips on 46nm, Qimonda shows the potential to regain technology
leadership in the DRAM industry, said Kin Wah Loh, President and CEO of, Qimonda AG. The new 2
Gigabit DDR3 is expected to significantly increase our productivity and reduce our cost per bit
once it is ramped up in production. In addition, the new chip is ideally suited for high-density
DDR3 server modules and will put us in
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Name
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Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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+49 89 60088 1200
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andreas.schaller@qimonda.com |
Page 2 of 3 February 3, 2009
the position of the energy efficiency leader in the market.
Intel Corporation recognized Qimondas top position in DDR3 technology. Qimonda delivered DDR3
memory modules that are industry leading in performance and power allowing optimal system
performance on Intel platforms, said Pat Gelsinger, Senior Vice President INTEL CORPORATION and
General Manager, Digital Enterprise Group, during a recent award ceremony.
With todays announcement, Qimonda takes an important step towards establishing the viability of
the core development and production capabilities of the company. This is a critical element of the
search for new investors.
No final decisions have yet been taken concerning the future structure of the company, including
whether those of its businesses that can be continued will be held through Qimonda AG or placed in
a new company owned by new investors. In the latter case, or if investors cannot be found to
finance the continuation of Qimondas businesses, Qimonda AG would likely be liquidated.
About Qimonda
Qimonda AG (OTC: QMNDQ.PK) is a global memory supplier with a diversified DRAM product portfolio.
The company generated net sales of Euro 1.79 billion in financial year
2008 and had prior to its announcement of a repositioning of its business approximately 12,200
employees worldwide, of which 1,400 were in Munich, 3,200 in Dresden and 2,800 in Richmond
(Virginia, USA). The company provides DRAM products with a focus on infrastructure and graphics
applications, using its power saving technologies and designs. Qimonda is an active innovator and
brings high performance,
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For the Trade Press |
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Public Relations
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Name
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E-mail |
Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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+49 89 60088 1200
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andreas.schaller@qimonda.com |
Page 3 of 3 February 3, 2009
low power consumption and small chip sizes to the market based on its
breakthrough Buried Wordline technology. Qimonda is currently continuing its operations while in
the early stages of insolvency proceedings under German law. Further information is available at
www.qimonda.com.
Disclaimer
This press release contains forward-looking statements based on assumptions and forecasts made by
Qimonda management and third parties. Statements that are not historical facts, including
statements about our beliefs and expectations, are forward-looking statements. These statements are
based on current plans, estimates and projections, and speak only as of the date they are made. We
undertake no obligation to update any of them in light of new information or future events. These
forward-looking statements involve inherent risks and are subject to a number of uncertainties,
including trends in demand and prices for semiconductors generally and for our products in
particular, the success of our development efforts, both alone and with our partners, the success
of our efforts to introduce new production processes at our facilities and the actions of our
competitors, the availability of funds for planned investments and repositioning efforts and the
outcome of antitrust investigations and litigation matters, as well as other factors. We caution
you that these and a number of other known and unknown risks, uncertainties and other factors could
cause actual future results, or outcomes to differ materially from those expressed in any
forward-looking statement. These factors include those identified under the heading Risk Factors
in our most recent Annual Report on Form 20-F which is available without charge on our website and
at www.sec.gov
For the Trade Press
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Public Relations
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Name
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E-mail |
Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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+49 89 60088 1200
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andreas.schaller@qimonda.com |
News Release § Presseinformation
Qimonda cuts costs and improves productivity
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Reduction of wafer starts at Dresden facility |
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Progress in development of 46nm Buried Wordline technology |
Munich/Dresden, Germany February 10, 2009 Memory supplier Qimonda today began a reduction in
wafer starts at its facility at Dresden to about one quarter of the available capacity. With this
move, Qimonda is responding to the negative market developments as well as to the necessity to cut
back loss making businesses and safeguard liquidity. At the same time, Qimonda has made further
progress with the development of its 46nm Buried Wordline technology and has been able to improve
yields of this new manufacturing process faster than originally expected.
We will reduce wafer starts at Dresden in order to reduce costs and safeguard liquidity. With this
liquidity, we intend to expedite the development of our 46nm Buried Wordline technology, with which
we can achieve market leading productivity and efficiency, said Frank Prein, General Manager of
Qimonda Dresden GmbH & Co. OHG. The preliminary insolvency administrator and the creditors
committee have agreed to this approach.
The reduction of wafer starts will have no immediate effect on deliveries to customers. Unused
equipment will be placed in a standby mode and can be ramped-up again at short notice. The
development of the new 46nm Buried Wordline technology, which makes possible an above-average leap
in productivity and offers greater energy efficiency than peer products in the market, will be
expedited without any reduction. We are convinced that in the current situation the successful
productivity improvement is the
For the Business and Trade Press
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Name
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E-mail |
Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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+49 89 60088 1200
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andreas.schaller@qimonda.com |
Page 2 of 3 February 10, 2009
best way to convince potential investors that Qimonda has a future, said Thomas Seifert, CFO
and COO of Qimonda AG. As soon as an investor is on board, Dresden can increase wafer starts
again.
First talks with potential investors have already been held during recent days. However, it is
still too early to make any assessment, according to the preliminary insolvency administrator, Dr.
Michael Jaffé and Kin Wah Loh, President and CEO of Qimonda AG.
A solution involving new investors must be found by end of March in order to assure the
continuation of operations at Qimonda. No final decisions have yet been taken concerning the future
structure of the company, including whether those of its businesses that can be continued will be
held through Qimonda AG or placed in a new company owned by new investors. In the latter case, or
if investors cannot be found to finance the continuation of Qimondas businesses, Qimonda AG would
likely be liquidated.
About Qimonda
Qimonda AG (OTC: QMNDQ) is a global memory supplier with a diversified DRAM product portfolio. The
company generated net sales of Euro 1.79 billion in financial year 2008 and had prior to its
announcement of a repositioning of its business
approximately 12,200 employees worldwide. The company provides DRAM products with a focus on
infrastructure and graphics applications, using its power saving technologies and designs. Qimonda
is an active innovator and brings high performance, low power consumption and small chip sizes to
the market based on its breakthrough Buried Wordline technology. Qimonda is currently continuing
its operations while in the
For the Business and Trade Press
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|
|
|
|
|
Public Relations
|
|
Name
|
|
Phone
|
|
E-mail |
Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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|
+49 89 60088 1200
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andreas.schaller@qimonda.com |
early stages of insolvency proceedings under German law. Further
information is available at www.qimonda.com.
Disclaimer
This press release contains forward-looking statements based on assumptions and forecasts made by
Qimonda management and third parties. Statements that are not historical facts, including
statements about our beliefs and expectations, are forward-looking statements. These statements are
based on current plans, estimates and projections, and speak only as of the date they are made. We
undertake no obligation to update any of them in light of new information or future events. These
forward-looking statements involve inherent risks and are subject to a number of uncertainties,
including trends in demand and prices for semiconductors generally and for our products in
particular, the success of our development efforts, both alone and with our partners, the success
of our efforts to introduce new production processes at our facilities and the actions of our
competitors, the availability of funds for planned investments and repositioning efforts and the
outcome of antitrust investigations and litigation matters, as well as other factors. We caution
you that these and a number of other known and unknown risks, uncertainties and other factors could
cause actual future results, or outcomes to differ materially from those expressed in any
forward-looking statement. These factors include those identified under the heading Risk Factors
in our most recent Annual Report on Form 20-F which is available without charge on our website and
at www.sec.gov
For the Business and Trade Press
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|
|
Public Relations
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|
Name
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Phone
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E-mail |
Worldwide Headquarters
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Ralph Heinrich
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+49 89 60088 1300
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ralph.heinrich@qimonda.com |
U.S.A.
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Glen Haley
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+1 919 677 4554
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glen.haley@qimonda.com |
Asia
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Isabel Chen
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+886 2 8170 8177
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isabel.chen@qimonda.com |
Investor Relations Worldwide
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Andreas Schaller
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+49 89 60088 1200
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andreas.schaller@qimonda.com |
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has
duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
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QIMONDA AG
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Date: February 12, 2009 |
By: |
/s/ Kin Wah Loh
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Kin Wah Loh |
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Chief Executive Officer and
Chairman of the Management Board |
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By: |
/s/ Thomas J. Seifert
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Thomas J. Seifert |
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Chief Operating Officer,
Chief Financial Officer and
Member of the Management Board |
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